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x8
1.8V
30ns
T/U/F
Mass production
x8
3.3V
30ns
T/U/F
Mass production
x16
1.8V
30ns
TSOP
Mass production
x16
3.3V
30ns
TSOP
Mass production
x8
1.8V
30ns
TSOP
Mass production
x8
3.3V
30ns
T/U
Mass production
x8
3.3V
30ns
T/U/F
Customer sample
x16
1.8V
30ns
TSOP
Mass production
x16
3.3V
30ns
TSOP
Mass production
x16
3.3V
30ns
TSOP
Customer sample
x16
3.3V
30ns
FBGA
Mass production
x8
3.3V
30ns
TSOP
Mass production
x8
3.3V
30ns
T/U
Mass production
x16
3.3V
30ns
TSOP
Mass production
x8
3.3V
30ns
TSOP
Mass production
x8
3.3V
30ns
TSOP
Mass production
x8
3.3V
30ns
ULGA
Mass production
x8
3.3V
30ns
ULGA
Mass production

Hynix has broad product portfolio, offering 128Mb to 256Gb densities in various types of packaging(i.e TSOP, LGA and FBGA). Due to the proliferation of digital content, NAND flash memory products are used in a wide variety of applications such as MP3/PMP, digital camera, camcorder, memory card, USB flash drive and other consumer electronics such as game console, navigation. Currently, Hynix NAND flash memory is being widely adopted in the mobile handset s and we are also developing PC storage solutions based on the NAND Flash chips.

NAND Flash Key Features

NAND Flash Key Features

NAND Flash Application

NAND Flash Application

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