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Users now demand a powerful, full-featured mobile system, with low power consumption, extended battery life and connectivity. New portable form factors such as Netbook have emerged in the PC Market. In addition to netbook, CULV (Consumer Ultra Low Voltage) and Ultrathin notebook mounted lowest power processors  will expedite notebook market in near future. A crossover to Mobile computers from the tradition Desktop has already occurred. Declining prices it the primary driving factors, especially in light of the current global economic conditions. Mobility and weight are other features that make mobile computers attractive to consumers. Server are now consolidating and adopting Virtualization technology to lower TCO (Total Cost of Ownership), with lower hardware costs and efficiencies. Higher speeds and higher density memory would be key requirements in a virtualized server environment.

DRAM Industry Event

DRAM Industry Event

DDR2/ DDR3 Speed Migration

DDR2/ DDR3 Speed Migration

DDR3 SDRAM

DDR3 SDRAM, which upholds the next generation main memory standard, can transfer data twice as fast as the current generation DRAM. Hynix’s DDR3 SDRAM boasts high performance and low power consumption. It supports data transfer rate up to 1.6Gb/s and operate at a voltage as low as 1.5V comparable to DDR2 which a previous version of DDR3. Hynix now offers high performance DDR3 in 1Gb and 2Gb densities and is also ready to launch 4Gb in near future. Hynix’s DDR3 also featuring functions such as 2Q calibrations, fly-by topology, dynamic on-die-termination and write levelization to ensure signal integrity and thus higher performance.
DDR3 SDRAM

Key Features of High Speed Interface

Key Features of High Speed Interface

Computing memory Features

Hynix has always been at the leading edge of memory innovation.
Hynix is currently supplying 54nm 1Gb/2Gb DDR3 and developing 46nm 1Gb/2Gb DDR3.
Hynix offers DDR3 Registered DIMMs which provide higher memory density, speed and memory bandwidth, and reliability for high performance servers.
Hynix is also able to provide 1.35V DDR3 RDIMMs for lower power consumption in server platforms.

Computing memory Module Line up

Computing memory Module Line up

Main Memory Applications

Main Memory Applications

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